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The Telescoping Yield Ramp

For most of its history, the IC industry could count on achieving a successful yield ramp quickly as it migrated to each new technology node. That expectation disappeared at 90nm. How will the industry recover? A new technical paper from HPL Technology argues that a new foundation - based on yield learning - is needed. Here are just four of the new foundation's requirements:

• Parts-per-billion sensitivity to all key yield-limiting topologies (not just random defects)
• Identification of non-visual defects, such as defects in high-aspect-ratio features and interfacial defects
• Direct identification of defect location and layer
• Ability to generate vastly more data than has been possible with traditional technology characterization vehicles.

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